CMP, often known as thermal oxidation sharpening, utilizes MP in conjunction with substances to improve the MRR and make improvements to floor excellent [20]. Figure two illustrates the schematic of a normal CMP process [21]. The SiC wafer, and that is mounted about the carrier, and the sprucing pad transfer https://www.facebook.com/permalink.php?story_fbid=pfbid0k16HbR2HLDydNQKktSQiLcDhkrdJrhCofdyAcVwR4GANGNaMcpjvtgbaVMhCRLb5l&id=61562415773754&__cft__[0]=AZV8J_qD86biHfRaXq-NtXSh91o95QYm9wYmIISM55EssZlLzvUx02BE3nRRMXIxgVaosTIYC2GadbizIOyt4afmJKW7rLwqYNR7Py_uwblnUOCjnewnNnWZvFn62BY47SVmxre3amN9HHGEpbid7GDB17nNMjaj_yacmVB8s2QMaA-4awaTtlJ_NemVzBcHtUleDQkvakWD6D-MqEfSfQU8&__tn__=%2CO%2CP-R